page 1 rev :a features -common anode esd protection. -surface mount package. -high component density . mechanical data -case: sot -23 standard package, molded plastic. -t erminals: gold plated, solderable per mil-std-750d, method 2026. -marking code:e24 -mounting position: any . -w eight: 0.0078 gram(approx.). qw -jp024 comchip t echnology co., l td. cpdt -24v -hf rohs device symbol t yp parameter min max unit junction capacitance conditions diode breakdown voltage v bd v i r = 1ma leakage current i l ua c t pf v r =0v ,f =1mhz 25 0.1 28 10 2.0 v r = 24v clamping voltage esd capability kv 1 6 peak pulse power p pp w 47 storage temperature operation temperature 125 o c t stg t j o c 150 -55 v c v i pp = 1a,t p =8/20us 47 t p =8/20us esd iec 61000-4-2(air) iec 61000-4-2(contact) 8 d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) s o t - 2 3 maximum ratings and electrical characteristics (at t a=25c unless otherwise noted) halogen free 3 1 2 0.1 19(3.00) 0.1 10(2.80) 0.056(1.40) 0.047(1.20) 0.079(2.00) 0.071(1.80) 0.041(1.05) 0.035(0.90) 0.020(0.50) 0.012(0.30) 0.006(0.15) 0.003(0.08) 0.100(2.550) 0.089(2.250) 0.004(0.10) max 0.012(0.30) 0.020(0.50) smd esd protection diode
ra ting and characteristic cur ves (cpdt -24v -hf) page 2 rev :a qw -jp024 comchip t echnology co., l td. r e v e r s e c u r r e n t , ( a ) p o w e r r a t i n g , ( % ) f i g . 1 - 8 / 2 0 u s p e a k p u l s e c u r r e n t w a v e f o r m a c c . i e c 6 1 0 0 0 - 4 - 5 f i g . 2 - r e v e r s e c h a r a c t e r i s t i c s f ig . 4 - p o w e r r a ti n g d e r a ti n g c u r v e reverse voltage (%) ambient temperature, (c) t ime (us) i p p m 0 % 2 0 % 4 0 % 6 0 % 8 0 % 1 0 0 % 0 1 0 2 0 3 0 4 0 8 us to 100% 20 us to 50us 2 0 4 0 6 0 8 0 1 0 0 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 mounting on glass epoxy pcbs 0 2 0 4 0 6 0 1 0 0 1 0 0 n 1 u 1 0 u 1 0 n 8 0 c a p a c i t a n c e b e t w e e n t e r m i n a l s , ( p f ) f i g . 3 - c a p a c i t a n c e b e t w e e n t e r m i n a ls c h a r a c t e r i s t i c s reverse voltage, (v) 0 3 6 9 12 15 0 10 20 30 40 smd esd protection diode
page 3 rev :a qw -jp024 comchip t echnology co., l td. b c d d d 2 d 1 s o t - 2 3 s y m b o l a ( m m ) ( i n c h ) 2 . 1 4 2 0 . 0 1 6 4 . 0 0 0 . 1 0 1 . 5 0 + 0 . 1 0 5 4 . 4 0 0 . 4 0 1 3 . 0 0 0 . 2 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 1 0 1 7 8 1 . 0 0 0 . 0 5 9 0 . 0 0 4 + 7 . 0 0 8 0 . 0 3 9 0 . 5 1 2 0 . 0 0 8 s y m b o l ( m m ) ( i n c h ) 0 . 0 . 0 0 4 1 5 7 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 4 e f p p 0 p 1 w w 1 1 . 7 5 0 . 1 0 0 . 0 6 9 0 . 0 0 4 3 . 5 0 0 . 0 5 0 . 1 3 8 0 . 0 0 2 s o t - 2 3 3 . 1 5 0 . 1 0 0 . 1 2 4 0 . 0 0 4 2 . 7 7 0 . 1 0 0 . 1 0 9 0 . 0 0 4 1 . 2 2 0 . 1 0 0 . 0 4 8 0 . 0 0 4 9 . 5 0 1 . 0 0 0 . 3 7 4 0 . 0 3 9 8 . 0 0 0 . 3 0 / + C 0 . 1 0 0 . 3 1 5 0 . 0 1 2 / + C 0 . 0 0 4 smd esd protection diode o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d 2 d w 1 t c direction of feed reel t aping specification i n d e x h o l e d e f b w p p 0 p 1 a
page 4 rev :a qw -jp024 comchip t echnology co., l td. cpdt -24v -hf e24 marking code e24 3 1 2 suggested p ad layout size (inch) 0.031 (mm) 0.80 1.90 2.02 0.075 0.080 sot -23 2.82 0.1 1 1 a b c d smd esd protection diode a c b d part number marking code standard packaging c a s e t y p e 3 , 0 0 0 r e e l ( p c s ) reel size (inch) 7 r e e l p a c k s o t - 2 3
|
